Case Study: Precision High-Voltage Power for Electrostatic Chucks

Supporting wafer clamping and process stability in semiconductor equipment

Application

Electrostatic chucks (ESCs) use electrostatic force to hold semiconductor wafers in place during processing.
Reliable clamping supports wafer temperature control, process stability, and repeatability, while controlled de-chucking allows the wafer to be released after processing.

The power system behind the chuck must deliver precise, reliable high voltage while accommodating the equipment’s operating temperature, control requirements, and radio-frequency (RF) environment. These demands make power supply selection an important part of semiconductor equipment design.

Application Challenges

For equipment manufacturers, integrating electrostatic chuck power involves several connected challenges:

• Precise high-voltage output: The power supply must support consistent electrostatic clamping throughout the process.
• Controlled clamping and release: Polarity switching capability supports the chuck’s clamping and de-chucking requirements.
• Different operating conditions: High- and low-temperature ESC applications require power options suited to their voltage, current, and power needs.
• RF integration: Equipment operating in demanding RF environments may require filtering alongside the high-voltage power supply.
• Limited installation space: Compact power supplies help equipment designers accommodate high-voltage functionality within constrained layouts.
• Control compatibility: The power system must interface with the equipment’s controls and available input power.

Addressing these requirements together helps establish a power architecture suited to the complete application.

Astrodyne TDI Solution

Astrodyne TDI offers electrostatic chuck power supplies with high-voltage output, polarity switching, compact packaging, and flexible control interfaces. High- and low-temperature options allow equipment manufacturers to select a configuration based on the chuck’s operating requirements.

Analog and discrete control inputs and outputs support equipment integration, with an option for a high-speed digital interface. Optional RF filtering expands the solution beyond the power supply, allowing manufacturers to source ESC power and filtering from a single supplier.

This approach supports coordinated selection of the power supply, controls, and filtering around the needs of the semiconductor tool.

Product Offering

High-Temperature ESC Power Supply

The high-temperature ESC offering provides up to ±1,500 VDC output with polarity switching for applications requiring higher current and power capability.

The available AC and DC input options provide flexibility when incorporating the supply into different equipment power architectures.

Low-Temperature ESC Power Supply

The low-temperature ESC offering provides up to ±1,000 VDC output with polarity switching in a compact DC-powered package.

For equipment requiring AC input, this supply can be used with a commercial off-the-shelf AC-DC converter.

Optional RF Filtering

Astrodyne TDI also offers RF filtering to complement the ESC power system. Filter selection can be coordinated with the application’s operating frequencies and electrical requirements, supporting integration in demanding semiconductor processing environments.

Conclusion

Electrostatic chuck performance depends on a power system that addresses more than output voltage alone. Precision, polarity switching, operating conditions, control compatibility, and RF filtering all contribute to a suitable equipment-level solution.

With high- and low-temperature ESC power supplies and optional RF filtering, Astrodyne TDI helps semiconductor equipment manufacturers address these requirements through a coordinated power and filtering offering.

Contact Astrodyne TDI to discuss the power and RF filtering requirements for your electrostatic chuck application.