The semiconductor industry is one of the most capital-intensive manufacturing sectors globally. In 2024, the global semiconductor manufacturing equipment market reached approximately $110 billion, with the majority of that investment dedicated to front-end wafer fabrication. The back-end assembly and test segment represents a smaller, yet critical, portion, estimated at around $20 billion annually.
At its core, semiconductor manufacturing transforms blank silicon wafers into the high-performance chips that power today’s most advanced technologies, from smartphones and EVs to artificial intelligence and data centers.
Front-end semiconductor manufacturing includes all the steps performed on a silicon wafer to create the integrated circuits. These processes can be grouped into four key stages:
Create (Deposition): Thin layers of materials such as metals and dielectrics are deposited using methods like CVD (Chemical Vapor Deposition) or ALD (Atomic Layer Deposition).
Shape (Etch): Selective material removal through plasma or wet etching defines the micro- and nano-scale geometries on the wafer surface.
Modify (Implant and Thermal): Ion implantation, oxidation, and annealing modify the wafer’s electrical characteristics to form transistor structures.
Analyze (Inspection and Metrology): Optical, electron-beam, and defect-review systems inspect wafers to ensure precision and process uniformity.
These high-precision processes require highly stable, programmable power systems that can deliver fast, accurate, and repeatable results under demanding conditions.
Once wafer fabrication is complete, the back-end stage involves dicing, packaging, and testing individual chips to ensure functionality and reliability. Equipment used here—such as bonders, handlers, and testers—requires flexible, safe, and efficient power systems to maintain high throughput and consistent test performance.
Astrodyne TDI’s power and distribution systems are engineered to support both front-end wafer processes and back-end assembly/test environments, ensuring reliability and control across the semiconductor production chain.
Semiconductor tools rely on custom-engineered power solutions tailored to their specific process requirements. Key needs include:
Customizable and programmable DC power supplies
High reliability and precision control with setpoint and readback accuracy typically within 0.1%
Fast transient response times under 1 millisecond for process stability
Scalable voltage and power ranges, often extending into the multi-kilovolt and multi-kilowatt domains, depending on the application
Flexible communication interfaces, including EtherCAT, Analog, and CAN protocols
Compliance with SEMI standards, such as:
SEMI F47: Voltage sag immunity
SEMI S2: Equipment safety guidelines
Copy Exactly (CE): Process consistency across fabs
Astrodyne TDI delivers power conversion and distribution solutions used across the entire semiconductor process flow, including:
Multi-Channel Magnet Drivers for precise plasma confinement and field control
Pedestal Heating Power Supplies for high-accuracy temperature management
E-Chuck Power Supplies for wafer electrostatic clamping
Pulse Power Systems for electroplating and advanced packaging
Semi-Test DC Sources up to tens of kilowatts for equipment verification
Power Distribution Units (PDUs) up to 100 kVA for fab and sub-fab environments
Each product family is engineered for reliability, configurability, and safety, with integrated protection, filtering, and communication capabilities that simplify OEM system design and support faster time to market.
As semiconductor devices continue to advance in complexity and performance, the need for precise and reliable power delivery becomes even more critical. Astrodyne TDI’s expertise in custom power conversion, distribution, and control enables equipment manufacturers to meet the industry’s stringent demands—powering innovation from wafer fabrication through final test.